TEMPE—Today, U.S. Representative Greg Stanton announced a $1.2 billion investment under the CHIPS and Science Act to fund a semiconductor research and development flagship facility at Arizona State University.
Last week, Stanton and Arizona leaders announced that Arizona State University’s Research Park in Tempe will host the National Semiconductor Technology Center Prototyping and Advanced Packaging R&D Facility, a state-of-the-art facility to test out prototype chips at scale. Stanton and the Arizona congressional delegation championed the proposal led by the Arizona Commerce Authority and ASU. This first-of-its-kind facility in the United States, which will be operational in 2028, will provide researchers and industry leaders from across the United States and around the world with the tools and resources needed to test new materials, devices, and advanced packaging solutions.
“Arizona has benefitted more than any other state from our CHIPS and Science Act. This historic funding will help ASU develop the next-generation technology America needs to compete and win on the world stage, and train the future of the semiconductor workforce here at home,” Stanton said.
The awards include:
- $100 million in direct funding to Arizona State University.?The award will support the development of the next generation of microelectronics packaging through fan-out-wafer-level-processing (FOWLP). Centered at ASU Advanced Electronics and Photonics Core Facility, this project supports ASU’s research in exploring the commercial viability of 300 mm wafer-level and 600 mm panel-level manufacturing, a technology that does not exist as a commercial capability in the U.S. today. Learn more about the CHIPS NAPMP Materials and Substrates award here.
- $1.1 billion in direct funding to Natcast’s Advanced Packaging Facility in Tempe, Arizona. The award will enable Natcast to operate and manage the CHIPS NAPMP advanced packaging capabilities that will be co-located with NSTC prototyping capabilities at the recently announced CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF) in Tempe, Arizona. Key packaging capabilities funded by this award are expected to include a baseline advanced packaging piloting line to enable the development and commercialization of new advanced packaging processes. The PPF will feature cutting-edge capabilities to bridge the gap between laboratory research and full-scale semiconductor production. This facility will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. Learn more about this CHIPS NAPMP award here.
Since the CHIPS and Science Act was signed into law, Arizona has benefitted from more than $11 billion in direct funding—the most of any state in the country. A fact sheet is available HERE.